DYNAMIC RESPONSE AND MICROSTRUCTURE EVOLUTION OF OXYGEN-FREE HIGH-CONDUCTIVITY COPPER LINER IN EXPLOSIVELY FORMED PROJECTILE

Authors

  • JIANFENG LIU COLLEGE OF FIELD ENGINEERING, PLA UNIVERSITY OF SCIENCE AND TECHNOLOGY
  • YUAN LONG COLLEGE OF FIELD ENGINEERING, PLA UNIVERSITY OF SCIENCE AND TECHNOLOGY
  • CHONG JI COLLEGE OF FIELD ENGINEERING, PLA UNIVERSITY OF SCIENCE AND TECHNOLOGY
  • DAOFENG XU HUBEI WEIDONG CHEMISTHY INDUSTRIES LIMITED LIABILITY COMPANY
  • DONG XIANG THE FIRST ENGINEERS SCIENTIFIC RESEARCH INSTITUTE OF THE GENERAL ARMAMENTS
  • GE SONG COLLEGE OF FIELD ENGINEERING, PLA UNIVERSITY OF SCIENCE AND TECHNOLOGY

Keywords:

EXPLOSIVELY FORMED PROJECTILE, OXYGEN-FREE HIGH-CONDUCTIVITY COPPER LINER, TEMPERATURE, MICROSTRUCTURE EVOLUTION, DYNAMIC RECRYSTALLISATION

Abstract

THE DYNAMIC RESPONSE AND MICROSTRUCTURE EVOLUTION OF OXYGEN-FREE HIGH-CONDUCTIVITY COPPER IN A SHAPED CHARGE LINER OF AN EXPLOSIVELY FORMED PROJECTILE ARE INVESTIGATED THROUGH MICROSTRUCTURAL EXAMINATION OF A SOFT-RECOVERED EFP. THEORETICAL CALCULATION RESULTS INDICATE THAT THE HIGHEST TEMPERATURE INCREASE OF EFP CAUSED BY SHOCK WAVE AND PLASTIC DEFORMATION CAN REACH 673K, WHICH IS 0.5TM (WHERE TM IS THE MELTING TEMPERATURE OF COPPER), AND THE FORMATION PROCESS OF COPPER EFP IS PRIMARILY CAUSED BY EXTREME PLASTIC FLOW, WHICH IS POSSIBLY A TYPE OF SUPERPLASTIC FLOW IN A SOLID STATE. THE MAIN BODY OF THE EFP UNDERGOES COMPLETELY DYNAMIC RECRYSTALLISATION, AND THE AVERAGE SIZE OF THE REFINED GRAINS SIGNIFICANTLY DECREASES TO APPROXIMATELY 10ΜM. A SLIGHT INCREASE IN GRAIN SIZE OCCURS MAINLY AWAY FROM THE CENTER AND EXTENDS TOWARDS THE HEAD AND REAR SECTIONS OF THE EFP. DURING THE DRX PROCESS, THE DISLOCATION MOVEMENTS ARE BELIEVED TO BE THE CONTROLLING MECHANISMS SIGNIFICANTLY REFINING THE MICROSTRUCTURE AND HELPING IN THE FURTHER FLOW OF THE MATERIAL.

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Published

2017-08-26

Issue

Vol. 14 No. 11 (2017)

Section

Articles

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